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Solder Paste Jet Printer Beyond Stencil Printing
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About Solder Paste Jet Printing

Revolutionizing Precision and Efficiency in PCBA Manufacturing

An innovative, contactless process that is reshaping the future of PCB assembly. This groundbreaking technology is not just a trend; it’s a necessity for manufacturers aiming to stay ahead in an increasingly competitive market.

High Precision
Flexibility
Reduced Waste
Non-Contact Process
Solder Paste Jet Printer
Creative concept designs

We make your
ideas become true

We believe in sustainable innovation.Choosing a partner is committed to your success.

  • CAD/Gerber file support
  • SMEMA Interface
  • Visual Positioning
  • Fiducial Mark Recognition
  • Smart and Simple
  • 0201 Pads
  • Even 01005 Pads
highlights of IPPMAC solder paste jet printer
Benefits
time to market picture

Time to Market
Rapid Prototyping Delivery

Business growth

PCB, FPC, Rigid-flex PCB etc.
Groove Pad Component

No stencil Storage
Digital management

Solder Paste Materials
Machine & Process

Minimizes Solder Paste Waste
No Stencil Cleaning

Customization Capabilities
Reducing Lead Time and Setup Cost

Highlights of Technology

What makes solder paste jetting technology so revolutionary?

Unlike traditional stencil printing, which requires a physical stencil and squeegee to deposit solder paste, jetting technology leverages high-speed, programmable nozzles to apply paste directly onto PCB pads. This process eliminates the need for stencils, making it highly adaptable for complex, small-scale, or prototype designs.

Amazing features

Streamline Your Assembly

Imagine the Possibilities

Reduced costs, faster production cycles, and the ability to tackle complex designs without compromising quality.

Imagine the Possibilities

Solder paste jetting technology is particularly beneficial for industries such as aerospace, medical devices, and consumer electronics, where precision and reliability are critical.
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High-density Interconnect (HDI)

Manufacturers producing fine-pitch components can achieve previously unattainable results with jetting technology.

High-density Interconnect (HDI)

The capability to adjust paste volume dynamically for each pad ensures perfect connections and minimizes defects like bridging or insufficient solder.
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Easy to Customize

This agility allows businesses to focus on innovation and rapid prototyping, staying competitive in markets that demand constant adaptation.

Easy to Customize

By eliminating the need for stencils, manufacturers can significantly cut down on maintenance, storage, and replacement costs.
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loved by our customers

Clients Testimonial

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