Revolutionizing Precision and Efficiency in PCBA Manufacturing
An innovative, contactless process that is reshaping the future of PCB assembly. This groundbreaking technology is not just a trend; it’s a necessity for manufacturers aiming to stay ahead in an increasingly competitive market.
We make your
ideas become true
We believe in sustainable innovation.Choosing a partner is committed to your success.
- CAD/Gerber file support
- SMEMA Interface
- Visual Positioning
- Fiducial Mark Recognition
- Smart and Simple
- 0201 Pads
- Even 01005 Pads
Time to Market
Rapid Prototyping Delivery
PCB, FPC, Rigid-flex PCB etc.
Groove Pad Component
No stencil Storage
Digital management
Solder Paste Materials
Machine &
Process
Minimizes Solder Paste Waste
No Stencil Cleaning
Customization Capabilities
Reducing Lead Time and Setup Cost
What makes solder paste jetting technology so revolutionary?
Unlike traditional stencil printing, which requires a physical stencil and squeegee to deposit solder paste, jetting technology leverages high-speed, programmable nozzles to apply paste directly onto PCB pads. This process eliminates the need for stencils, making it highly adaptable for complex, small-scale, or prototype designs.
Streamline Your Assembly
Imagine the Possibilities
Imagine the Possibilities
High-density Interconnect (HDI)
High-density Interconnect (HDI)
Easy to Customize
Easy to Customize
Clients Testimonial
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